GlobalFoundries will manufacture silicon interposers for Taiwan Semiconductor Manufacturing Co. ’s CoWoS advanced-packaging system under a five-year agreement valued at $2 billion. The work will expand production capacity at GlobalFoundries’ Malta, New York, facility and create what the company describes as the first U.S. -based source for these components.
Silicon interposers sit beneath processors and high-bandwidth memory stacks inside advanced packages. They provide dense, high-speed connections between the components, enabling multi-die processors used in artificial-intelligence and high-performance-computing systems.
The agreement also creates a framework for adding capacity as demand grows, although the companies have not disclosed planned production volumes, capital spending or how the $2 billion will be allocated.
The interposers will support TSMC’s CoWoS packaging ecosystem, but the pact does not cover every stage of making finished AI processors. Chip assembly, bonding, packaging onto substrates and electrical testing require separate capacity. TSMC is also expanding advanced packaging operations in Arizona, where it has said a packaging facility is expected to begin operating in 2029.
Manufacturing source for a component used in increasingly complex AI packages, while allowing GlobalFoundries to participate in advanced AI hardware production without manufacturing the leading-edge processor dies themselves. The companies have not said how the interposers will be divided among U.S.