Nvidia is arranging a broad expansion of its semiconductor supply chain as demand grows for accelerated-computing systems and AI infrastructure. The plans announced at GTC Berlin cover package substrates, advanced packaging, semiconductor testing and optical engines, with six partners involved: Amkor Technology, IBIDEN, King Yuan Electronics, Samsung Electro-Mechanics, Siliconware Precision Industries and Unimicron Technology.
IBIDEN’s Ono plant in Japan is targeting capacity three times its current level, with additional output expected to begin ramping in the first quarter of 2028. Samsung Electro-Mechanics is joining Nvidia’s substrate supply chain through existing South Korean operations, facility upgrades and planned factories in Sejong and Busan. Unimicron’s Taiwanese expansion is expected to begin adding capacity in the second quarter of 2027 and reach full capacity by mid-2028.
Amkor and Nvidia are targeting a more than 300% increase in interposer wafer capacity in South Korea by the end of 2028. Advanced-packaging expansion in Arizona. Amkor’s broader plans combine that U.S. Capacity with its established operations in Asia.
Testing capacity is also scheduled to double from 2026 to 2027 through projects in the United States, Taiwan and Singapore. Testing facilities and equipment, where high-volume production is targeted for April 2027. Expanded Singapore operations are expected to enter high-volume production in February 2027.
Siliconware Precision Industries plans to increase Taiwan production of optical engines used in co-packaged optics 15-fold by mid-2027, with another doubling targeted by the end of 2028. These targets are forward-looking plans, so their timing and scale remain subject to execution and production conditions.